John Glossner : SDR Insider
John Glossner
Sandbridge Technologies CTO & EVP. A fabless semiconductor company building SDR baseband processors.

July 2011

You are browsing the archive for July 2011.

Ten mobile vendors license chip interconnect

July 29, 2011

Intel, Samsung, LG, ST–Ericsson, Huawei's HiSilicon Technologies subsidiary, and Via Telecom licensed C2C along with three undisclosed chip makers. The link enables a 100ns round-trip latency, so processor and modem chips can share a single DRAM.

Leaving Ubuntu?

July 23, 2011

I’ve been a huge fan of Ubuntu. I use it on almost all my computers even when I have to keep Windows installed on some of them. Virtualbox definitely helps make this livable. However, with the introduction of Ubuntu 11.04 which I’ve been using on my Dell Precision M4300 since the day of its release [...]

Parallel x86 software support for $250

July 21, 2011

Vector Fabrics BV has announced the availability of its vfThreaded-x86 cloud-based software tool to help with the parallelization and optimization of applications for multi-core x86 architectures. View the full article HERE.

Huawei rolls baseband as LTE expands

July 21, 2011

China telecom giant Huawei Technologies is shipping its own HSPA baseband silicon, according to a new teardown report by ABI Research.View the full article HERE.

Cognovo: soft modem can reduce power

July 21, 2011

Cognovo Ltd. has said that its MCE160 software-defined modem, a version of which is currently being manufactured on its behalf by Samsung Foundry in 45-nm, is expected to consume less than 100-mW peak for simultaneous transmit and receive in LTE and si...

CEVA Improves CEVA-XC DSP Product Offering With HSPA+ Software IP

July 12, 2011

Together with our communications and LTE software libraries, we offer the industry's most comprehensive SDR architecture for 3G/4G modem design, which fundamentally reduces both time-to-market and development investment,” said Eran Briman, ...See...

ZTE Achieves World’s First TD-LTE and 2G/3G Handover Interoperability Test

July 12, 2011

ZTE Corporation, a publicly-listed global provider of telecommunications equipment and network solutions, today announced that it has completed the industry’s first interoperability test (IOT) between TD-LTE terminals and GSM/UMTS/CDMA EV-DO networks.

HTC to buy graphics chip firm S3

July 6, 2011

Taiwanese handset vendor HTC agreed to purchase graphics chip vendor S3 Graphics for $300 million from microprocessor vendor VIA Technologies and private investment firm WTI Investment International.View the full article HERE.